Electronic Fabrication Technician
Columbus TechnologiesO VERVIEW Must be a US Citizen Duration - 2 year contract position with potential to be extended or converted W2 with full benefits, 9/80 Work Schedule Customer and contract specific training will be required and provided. Location - NASA Jet Propulsion Laboratory, Pasadena, CA (onsite) Offer contingent on ability to successfully pass a background check and drug screen The US base pay range for this full-time position is $30-53/hr + benefits. Salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. JOB DESCRIPTION As an Electronic Fabrication Technician III, you will be supporting the Electronic Manufacturing, Packaging, & Technical Services Section, which provides engineering services that include the following: fabrication of electronics (boards and cables/harnesses), microelectronic and photonic hardware; electronic packaging, manufacturing engineering and electronic hardware thermal/structural analysis; advanced electronic packaging engineering, technology development and process engineering; technical facilities management and cleanroom services/certification; custom measurement systems development and instrumentation services; calibration services, test equipment loan pool and metrology engineering, and technical inventory management, cryogenics services and Flight Hardware Logistics Program (FHLP). POSITION RESPONSIBILITIES Perform surface mount technology setup, printed wiring board electronic assembly, hand soldering, connector pin crimping, cabling, chassis wiring, mechanical assembly, and chassis wiring for engineering model and flight electronic systems. Use and operate modern and manual manufacturing tools and equipment to produce high reliability printed wiring electronic assemblies and hybrid/microelectronic assemblies. REQUIRED SKILLS Typically requires a High School diploma with a minimum of 8 years of general experience. Has used innovative and creative approaches in resolving unusual situations. Participated on teams within and outside of own organization. Ability to work under a microscope. Support the manufacturer engineer in assessing and recommending design modifications. Support various customer labs and the Spacecraft Assembly Facility in final integration, when required. DESIRED SKILLS Perform cable operations including soldering, crimping, routing on mockups, wrapping cable assemblies, testing, potting, and closing connectors. Operate manual manufacturing tools and equipment to produce high-reliability cable and harness assemblies. Demonstrated IPC J-STD-001 and/or NASA 8739 certification training. Demonstrated experience in Surface Mount Technology printed wiring assemblies. Demonstrated experience in polymerics adhesives, potting, and conformal coating material application and mixing. Demonstrated experience with JPL fabrication standards for printed wiring electronic assemblies, cables and harnesses. Knowledge of electronic and mechanical fabrication techniques to fabricate and assemble complex mechanical, electronic, electro-mechanical, cable harness assembly, devices, fixtures, parts or equipment. Understanding of work techniques, applicable policies, procedures and practices in planning, setup, repair and/or modification of mechanical, electronic or electro-mechanical systems, experimental design circuitry, prototype models or specialized test equipment. Experience in working from schematics, rough sketches, diagrams, layouts or plans often requiring interpretation. Experience working in cleanroom environments and ESD workstations. Equal Opportunity/Affirmative Action Columbus is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without rega…