Professor (all ranks) Materials, Mechanics, and Processing for Microelectronic Packaging

Location Tempe Campus Open Date Oct 10, 2026 Description The Ira A. Fulton Schools of Engineering at Arizona State University (ASU) and the School for Engineering of Matter, Transport and Energy (SEMTE) seek applicants for a tenure-track or tenured faculty position in Materials, Mechanics, and Processing for Microelectronic Packaging. The search addresses the materials, processing, and mechanics that determine how packaged microelectronic systems are built and how they perform. We welcome candidates whose research is experimental, theoretical, or computational, and particularly encourage candidates who integrate these approaches. SEMTE (https://semte.engineering.asu.edu/), one of the eight Fulton Schools, houses a vibrant mechanical, aerospace, materials, and chemical engineering research community (learn more at https://research.engineering.asu.edu/). We seek applicants who can enhance our abilities in these areas as part of a community of experts. Particular areas of interest include, but are not limited to: Thermomechanical reliability of advanced packages: warpage, residual stress, and die and substrate coplanarity; interfacial fracture and delamination, including at hybrid-bonded and direct-bonded interfaces; solder and interconnect fatigue; electromigration; moisture and corrosion; drop and shock survivability; materials compatibility with direct liquid and immersion cooling; and accelerated test and lifetime prediction methods. Mechanics of materials for heterogeneous integration: constitutive behavior of solders, underfills, and mold compounds, including encapsulants with tailorable thermomechanical properties; cure-, bonding-, and process-induced stress; mechanics of temporary bonding, debonding, and carriers for wafer and panel handling; and deformation and failure at small length scales and across dissimilar-material interfaces. Materials, interfaces, and processing for advanced packaging: interconnect and bonding materials; hybrid and direct bonding, thermal compression bonding, and fan-out wafer- and panel-level processes; redistribution layers, plating chemistries, and low-loss dielectrics; glass-core and organic substrates, including through-glass vias; embedded components and package-integrated passives; buried-interface chemistry and microstructure; materials for sustainable manufacturing, including non-PFAS alternatives; and wafer- and panel-level process-structure-property relationships. Characterization, metrology, and failure analysis: electron microscopy; X-ray and synchrotron methods; full-field deformation measurement; non-destructive acoustic and X-ray imaging for buried interfaces and known-good-die screening; small-scale mechanical testing; and in-situ and operando techniques. Thermal transport and thermal management for high-power-density packages: embedded cooling architectures; thermal control for 3D stacks and co-packaged optics; die-to-die thermal resistance and cross-talk; thermal isolation and spreading; thermal interface materials; and thermal and thermomechanical property measurement. Modeling, simulation, and data-driven analysis: multiscale and multiphysics modeling; constitutive model development; prediction of process-induced stress and warpage; design-for-reliability; and AI/ML methods linking metrology and test data to yield and reliability outcomes. We search for applicants who will contribute to our academic programs, promote transdisciplinary teaching and research, and help the university to achieve its aspirations, including enabling student success, transforming society, valuing entrepreneurship, and conducting use-inspired research. Faculty members in the Fulton Schools are expected to develop an internationally recognized and externally funded research program, adopt effective pedagogical practices in the development and delivery of undergraduate and graduate courses, advise both undergraduate and graduate student research and projects, and undertake service activities. ASU sits…

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