Electronics Engineer III
Dragonfly Energy CorpPOSITION SUMMARY Lead the design, development, board layout, testing, and system integration of complex printed circuit board assemblies (PCBAs) and custom hardware components. KEY RESPONSIBILITIES · Hardware Architecture & Circuit Design: Design digital, analog, mixed-signal, and power distribution hardware architectures. Select components, perform worst-case analyses, use design tools such as Altium Designer or KiCad. · System Design and Integration: Inform design and product management using application requirements for target markets, competing and complimentary power electronics products, and downstream system standards and requirements. · PCB Layout & Routing: Perform or directly supervise multi-layer PCB layouts, taking into account signal integrity (SI), power integrity (PI), thermal management, and strict Design for Manufacturing/Assembly (DFM/DFA) guidelines. · Prototyping & Board Bring-Up: Lead hands-on assembly, testing, debugging, and verification of initial hardware prototypes using laboratory equipment (oscilloscopes, logic analyzers, spectrum analyzers, dynamic loads). · Firmware & Software Collaboration: Partner closely with embedded firmware, software, and mechanical engineering teams to define interface protocols, pinouts, mechanical enclosures, and system test points. · Regulatory & Compliance: Design for Electromagnetic Compatibility (EMC/EMI), ESD protection, and environmental compliance (UL, CE, FCC, RoHS). Prepare and support hardware for third-party compliance testing. · Manufacturing & Supply Chain Support: Generate comprehensive manufacturing documentation (Gerber files, drill charts, BOMs, schematic PDF packages, assembly drawings). Collaborate with vendors and contract manufacturers (CMs) to resolve component obsolescence or DFM issues. · Collaboration & Quality Standards: Establish and promote internal hardware design standards, review peer schematics and PCB layouts, work with support teams to perform analysis and troubleshooting on products in the field, and mentor junior engineers. REQUIRED QUALIFICATIONS · Bachelor’s degree in Electrical Engineering (BSEE), Computer Engineering, or a related discipline. · 5+ years of progressive, hands-on experience in electronics engineering and hardware development. · Proven track record of designing, layout routing, and releasing multi-layer PCBs (4+ layers, high-speed routing, controlled impedance, thermal management, and/or rigid-flex experience preferred). · Proficiency in industry-standard schematic capture and PCB layout tools (e.g., Altium Designer, Cadence Allegro, KiCAD, PADS). · Advanced proficiency with bench tools including digital storage oscilloscopes, logic analyzers, spectrum analyzers, signal generators, and precision multimeters. · Solid understanding of common hardware protocols (I2C, SPI, UART, CAN, Ethernet, USB, PCIe) and power supply architectures (buck/boost regulators, LDOs, battery management). · Demonstrated understanding of IPC standards (IPC-2221, IPC-A-610), manufacturing processes, component sourcing, and Gerber generation. PREFERRED QUALIFICATIONS ● Experience with wireless standard implementations (Bluetooth, Wi-Fi, LoRa, or Cellular hardware integration). ● Knowledge of signal integrity (SI) and power integrity (PI) simulation tools (e.g., Ansys, HyperLynx). ● Scripting capability (Python, C/C++) for laboratory test automation and hardware validation. ● Prior experience working in regulated industries (automotive, aerospace, medical devices, or energy storage). Pay: $115,000.00 - $175,000.00 per year Benefits: 401(k) matching Dental insurance Health insurance Paid time off Parental leave Vision insurance Work Location: In person